| 摘要 |
PURPOSE: A chip component structure is provided to effectively clean residue of a flux remaining in a gap between an interposer and a circuit board in a mounted state by making processing solution and air be easily discharged. CONSTITUTION: A chip component structure(1) includes an interposer(3). The interposer mounts a multilayer condenser(2). The interposer includes a substrate(31), a component connection electrode(32A,32B), an exterior connection electrode(33A,33B) and a side electrode(34A,24B). The component connection electrode and the exterior connection electrode are electrically connected by the side electrode. The component connection electrode is connected with an external electrode of the multilayer condenser. A connection hole(39B) is formed on the substrate. The connection hole connects spaces being opened and facing each other. |
