发明名称 |
LIGHT EMITTING DIODE PACKAGE AND BACKLIGHT UNIT INCLUDING THE SAME |
摘要 |
<p>PURPOSE: A light-emitting diode package and a backlight unit including the same are provided to prevent upset or inclination when mounting by forming a lead frame unit and support unit. CONSTITUTION: A lead frame(200,300) includes a first lead and a second lead. A light-emitting diode chip(100) is mounted on the first lead. The second lead is separated with the first lead. A housing unit(400) includes an opening unit(430). The housing unit surrounds some part of the lead frame. The opening exposes the light-emitting diode chip. The housing unit has a first side and a second side. A lead heat radiation unit(250) is partially exposed in the first side of the housing unit. The support unit supports the housing unit including the lead frame.</p> |
申请公布号 |
KR20130015920(A) |
申请公布日期 |
2013.02.14 |
申请号 |
KR20110078257 |
申请日期 |
2011.08.05 |
申请人 |
SEOUL SEMICONDUCTOR CO., LTD. |
发明人 |
LEE, JAE JIN |
分类号 |
F21S2/00;G02F1/13357;H01L33/48 |
主分类号 |
F21S2/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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