发明名称 SUBSTRATE PROCESSING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To extend the life of a lamp for heating a substrate. <P>SOLUTION: A substrate processing apparatus comprises: a light receiving chamber where a substrate is processed; a substrate support part provided in the light receiving chamber and supporting the substrate; a lamp which has lamp electric wiring and a sealing part that encloses the lamp electric wiring and hermetically sealing a gas in the lamp, and radiates light to the substrate supported by the substrate support part, a lamp housing part which is provided at the exterior of the light receiving chamber and has the lamp, a lamp connection member connecting with the lamp and supplying a current to the lamp electric wiring; a heat absorbing member formed by a material having heat conductivity higher than that of the sealing part, covering the periphery of the sealing part, and contacting with the sealing part, and a foundation member for contacting with and fixing the heat absorbing member; and an external electrical wiring connecting with the lamp connection member and supplying the current to the lamp connection member. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013033946(A) 申请公布日期 2013.02.14
申请号 JP20120141686 申请日期 2012.06.25
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 YUYA YUKINORI;SHIMADA TOSHIYA;SHINOZAKI KENJI;AMANO TOMIHIRO;ASHIHARA YOJI;NOUCHI HIDEHIRO;MIYAKE MASAHIRO;HIYAMA MAKOTO
分类号 H01L21/26;H01L21/205;H01L21/31;H01L21/683 主分类号 H01L21/26
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