发明名称 COMPACT, THERMALLY-ENHANCED SUBSTRATE FOR LIGHTING APPLICATIONS
摘要 A solid state light source module (100) having a compact, thermally enhanced substrate (102) with one or more recessed pockets (106), is provided. The module (100) includes a solid state light source (104) and an electrical connection for the solid state light source (104), such that it is able to receive power so as to generate light. The solid state light source (103) is connected to a substrate (102) having an upper surface (120) and a lower surface (140). The substrate (102) includes a recessed pocket (106) in the upper surface (120), defined by a wall (166) and a floor (164) that are at least large enough to accommodate the solid state light source (104); thus, the solid state light source (104) sits within the recessed pocket (106). This allows the module (100) to be substantially flat, even with an attached optical system (160), even utilizing remote phosphor technology, and increases the amount of heat dissipated by a thermal management system that is part of, or connected to, the module (100).
申请公布号 WO2013022861(A1) 申请公布日期 2013.02.14
申请号 WO2012US49801 申请日期 2012.08.06
申请人 OSRAM SYLVANIA INC.;GHIU, CAMIL-DANIEL;BAZYDOLA, SARAH;OZA, NAPOLI 发明人 GHIU, CAMIL-DANIEL;BAZYDOLA, SARAH;OZA, NAPOLI
分类号 H05K1/18;F21K99/00;F21V29/00;F21Y101/02 主分类号 H05K1/18
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