| 摘要 |
<p>PURPOSE: A stacked semiconductor package is provided to form a stack post corresponding to the property of the semiconductor package by controlling the number of balls which form a post according to the size and shape of a semiconductor chip or the size of the ball. CONSTITUTION: A substrate(210) includes a connection pad(230) formed around a first semiconductor chip(110). The first semiconductor chip is electrically connected to the substrate through a plurality of bumps(130). A stack post(400) is electrically connected to the connection pad. The stack post includes a top stack ball(410) and a bottom stack ball(420). A second semiconductor chip(310) is electrically connected to the stack post.</p> |
