METHOD FOR POLISHING GLASS SUBSTRATE, METHOD FOR MANUFACTURING PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS AND RADIO-CONTROLLED TIMEPIECE

摘要

PROBLEM TO BE SOLVED: To provide a method for polishing a glass substrate which can improve the surface accuracy of a joint surface of a glass substrate to secure air-tightness in a cavity, and to provide a method for manufacturing a package, a piezoelectric vibrator, an oscillator, an electronic apparatus and a radio-controlled timepiece.

SOLUTION: The method for polishing a glass substrate includes a polishing step where a joint surface 53 of a wafer 50 for a lid substrate is polished while an abrasive is fed thereto. The polishing step includes: a pre-stage polishing step of polishing the joint surface 53 of the wafer 50 for a lid substrate while using a first abrasive containing a cerium oxide as the principal component; and a post-stage polishing step of polishing the joint surface 53 of the wafer 50 for a lid substrate while using a second abrasive containing a colloidal silica as the principal component.

COPYRIGHT: (C)2013,JPO&INPIT