发明名称 3D ARCHITECTURE FOR BIPOLAR MEMORY USING BIPOLAR ACCESS DEVICE
摘要 Memory device and method for fabricating a memory device on two layers of a semiconductor wafer. An example device includes bit lines and word lines fabricated at one layer of a semiconductor wafer and re-writable nonvolatile memory cells that include a two-terminal access device with a bidirectional voltage-current characteristics for positive and negative voltages applied at the terminals. Additionally, a drive circuit electrically coupled to the memory cells and configured to program the memory cells is fabricated at another layer of the semiconductor wafer. Another example embodiment includes a memory device where a plurality of memory arrays are fabricated at one layer of a semiconductor wafer and a plurality of drive circuits electrically coupled to the memory cells and configured to read the memory cells are fabricated at a second layer of the semiconductor wafer.
申请公布号 US2013039110(A1) 申请公布日期 2013.02.14
申请号 US201113209405 申请日期 2011.08.14
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION;LAM CHUNG H.;LI JING;GOPALAKRISHNAN KAILASH 发明人 LAM CHUNG H.;LI JING;GOPALAKRISHNAN KAILASH
分类号 G11C5/02;H01L21/02 主分类号 G11C5/02
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