| 摘要 |
PROBLEM TO BE SOLVED: To provide a photocurable composition and an adhesive exhibiting high adhesion to a material such as copper or nickel to which a photocurable composition is hardly stuck conventionally and capable of adapting to a substrate field having a heating step. SOLUTION: The photocurable composition comprises (1) a compound having reactive double bonds, (2) a compound having two or more mercapto (-SH) groups in one molecule, (3) a photopolymerization initiator and (4) a compound having phosphoric ester groups. The adhesive for metal comprises the photocurable composition and the metal is preferably copper. COPYRIGHT: (C)2009,JPO&INPIT |
