| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a transfer device capable of accurately performing pickup with a single configuration and manufacturing a flake body with an adhesive layer, and a transfer method. <P>SOLUTION: A transfer device 1 comprises: first support means 2 for supporting a wafer W via an adhesive sheet S1; second support means 3 for supporting a transfer sheet S2 by arranging the sheet so as to face the wafer W; contact means 4 for bringing the wafer W into contact with the transfer sheet S2 by moving them in a direction in which they approach with each other; fluidization means 5 for fluidizing an adhesive layer AD2 of the transfer sheet S2; pressing means 6 for pasting the adhesive sheet S1 to an adhesive layer AD2 by distorting the adhesive sheet S1; and cutting means 7 for cutting the adhesive layer AD2 from a base material sheet BS2 by moving the adhesive sheet S1 in a direction in which it separates from the transfer sheet S2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
