| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a liquid resin composition excellent in workability and heat conductivity, and a semiconductor device excellent in heat dissipation and high reliability when the composition is used as a semiconductor die attach material or an adhesive for a heat dissipation material. <P>SOLUTION: The liquid resin composition contains (A) a compound having a radically polymerizable functional group, (B) a non-electroconductive thermoconductive filler, and (C) a thixotropy-imparting agent, wherein the (B) has a specific surface area of 5 to 9 m<SP POS="POST">2</SP>/g; the content of the (B) is 35 to 50 vol%; and the content of the (C) is ≤1 wt.%. <P>COPYRIGHT: (C)2013,JPO&INPIT |
