PREPREG, SUBSTRATE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a prepreg which deals with the creation of thin film form and adjusts the amount of a resin according to a circuit pattern, and to provide a substrate and a semiconductor device which have the prepreg.

SOLUTION: A prepreg 10c of this invention has: a fiber base material 1 formed by glass fibers; a first resin layer 21 positioned on one surface side of the fiber base material 1; and a second resin layer 22 positioned on the other surface side of the fiber base material 1. The first resin layer 21 and the second resin layer 22 are respectively formed by resin compositions including a thermosetting resin and an inorganic filler. The thickness of the first resin layer 21 is larger than that of the second resin layer 22. A circuit wiring part 4 is buried in the first resin layer 21.

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