发明名称 |
LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
There are provided a light emitting device package and a method of manufacturing the same. The light emitting device package includes a body part including a through hole formed in a thickness direction; at least one light emitting device disposed within the through hole; and a wavelength conversion part filling the through hole and supporting the light emitting device.
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申请公布号 |
US2013032842(A1) |
申请公布日期 |
2013.02.07 |
申请号 |
US201213563227 |
申请日期 |
2012.07.31 |
申请人 |
PARK JONG KIL;ZHANG SUNG UK;SONG JONG SUP |
发明人 |
PARK JONG KIL;ZHANG SUNG UK;SONG JONG SUP |
分类号 |
H01L33/60;H01L33/48 |
主分类号 |
H01L33/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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