THERMOPLASTIC RESIN COMPOSITION FOR REFLECTIVE MATERIAL, REFLECTIVE PLATE, AND LIGHT-EMITTING DIODE ELEMENT

摘要

The purpose of the present invention is to provide a thermoplastic resin composition for a reflective material which has excellent molded product mechanical strength, represented especially by toughness, excellent heat resistance, high reflectance, and excellent moldability, and which makes it possible to obtain a reflective plate with little decline in reflectance caused by heating such as in the steps for producing an LED or in a reflow soldering step. A first embodiment of this thermoplastic resin composition for a reflective material includes: 30 to 85 mass% of a polyester resin (A) that has a melting point or glass transition temperature of 250°C or higher and includes an alicyclic hydrocarbon structure; 0.1 to 15 mass% of a thermoplastic resin (B) that has a polyolefin backbone and a functional group structure; 5 to 50 mass% of a white pigment (C); and 10 to 50 mass% of an inorganic filler (D); the thermoplastic resin (B) either including 0.1 to 1.8 wt% of a functional group structure unit (B1) that further includes a heteroatom, or further including an aromatic hydrocarbon structure (B2), and the limiting viscosity [?] being 0.04 to 1.0 dl/g.