| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermal head that reduces the possibility of separation between a head substrate and an external substrate. <P>SOLUTION: The thermal head X1 includes: a head substrate 3 and an external substrate 5. The head substrate 3 has a substrate 7, a plurality of heat generating parts 9 provided on the substrate 7, and an electrode 17b for applying a voltage to the heat generating parts 9. The external substrate 5 has a wiring substrate 8, a wiring conductor 10 provided on the wiring substrate 8, and a coating layer 14 coating the wiring conductor 10. The electrode 17b of the head substrate 3 and the wiring conductor 10 of the external substrate 5 are joined with an anisotropic electrically-conductive adhesive agent 16. On an upper surface in a region joined with the head substrate 3, the external substrate 5 has an exposed part 12 from which the wiring conductor 10 is exposed. The exposed part 12 and the electrode 17b are connected to each other with solder 18. The solder 18 is provided across the exposed part 12, lateral surfaces of the external substrate 8, and the electrode 17b. <P>COPYRIGHT: (C)2013,JPO&INPIT |
