| 发明名称 |
CIRCUIT MATERIALS WITH IMPROVED BOND, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM |
| 摘要 |
A circuit material, comprising a conductive metal layer or a dielectric circuit substrate layer and an adhesive layer disposed on the conductive metal layer or the dielectric substrate layer, wherein the adhesive comprises a poly(arylene ether) and a polybutadiene or polyisoprene polymer.
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| 申请公布号 |
US2013034725(A1) |
申请公布日期 |
2013.02.07 |
| 申请号 |
US201213649333 |
申请日期 |
2012.10.11 |
| 申请人 |
WORLD PROPERTIES, INC.;WORLD PROPERTIES, INC. |
发明人 |
PAUL SANKAR K. |
| 分类号 |
B32B7/12;B32B15/06;B32B15/085;B32B33/00 |
主分类号 |
B32B7/12 |
| 代理机构 |
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