| 发明名称 |
ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE AND CIRCUIT CONNECTING MATERIAL USING SAME ADHESIVE COMPOSITION, CONNECTION STRUCTURE FOR CIRCUIT MEMBER AND MANUFACTURING METHOD FOR SAME |
| 摘要 |
<p>The present invention provides an adhesive composition comprising (A) an organic aluminum complex, (B) a silane coupling agent, and (C) a curing component.</p> |
| 申请公布号 |
WO2013018152(A1) |
申请公布日期 |
2013.02.07 |
| 申请号 |
WO2011JP67387 |
申请日期 |
2011.07.29 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD.;KAWAKAMI SUSUMU |
发明人 |
KAWAKAMI SUSUMU |
| 分类号 |
C09J201/00;C09J4/00;C09J7/00;C09J11/06;H01B1/20;H01L31/042;H01R4/04;H01R11/01 |
主分类号 |
C09J201/00 |
| 代理机构 |
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代理人 |
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| 地址 |
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