| 摘要 |
PURPOSE: A light emitting device package and a lighting system having the same are provided to reduce the thickness of the light emitting device package by using a flip bonding. CONSTITUTION: A first cavity(125) is formed in a first area between the upper part of a body and the side part. A second cavity(135) is formed in a second area between the upper part of a body and the lower part. Lead frames(121,131,141) are arranged within the first cavity and the second cavity. A first molding material(161) and a second molding material(162) are made of a transparent resin layer. |
