MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD

摘要

PURPOSE: A printed circuit board manufacturing method is provided to etch a circuit layer in an opening unit, thereby easily forming high illumination on the circuit layer. CONSTITUTION: A base substrate including a first circuit layer(110) and an insulating layer(120) formed on the first circuit layer is prepared. Illumination(111) is formed on a surface of the first circuit layer. A seed layer(150) is formed on the insulating layer. A plating resistor pattern is formed in a circuit forming area of the seed layer. A metal layer(170) is formed on the plating resistor pattern. A second circuit layer(140) including a via-hole is formed.