| 摘要 |
A substrate cleaning apparatus includes: a substrate entering guide unit for entering a substrate from outside in a proper direction; a foreign material removing unit for receiving the substrate from the substrate entering guide unit and removing debris formed on the substrate; a foreign material cleaning unit for receiving the substrate from the foreign material removing unit and cleaning to remove debris remaining on the substrate; and a position controller for controlling the position of the substrate carried out of the foreign material cleaning unit, wherein the foreign material cleaning unit includes: a manifold including a plurality of deionized water holes, suction holes and air holes; and a porous cleaning plate combined to the manifold by an upper fastening screw including a through hole communicating with the plurality of deionized water holes and suction holes. |
