| 摘要 |
<p>The distribution of Ni-Si compound grains is controlled to thereby improve the properties of Corson alloys. The copper alloy for electronic materials comprises 0.4 to 6.0% by mass of Ni and 0.1 to 1.4% by mass of Si, with the balance being Cu and unavoidable impurities. The copper alloy comprising:
small particles of Ni-Si compound having a particle size of equal to or greater than 0.01 µ m and smaller than 0.3 µ m; and
large particles of Ni-Si compound having a particle size of equal to or greater than 0.3 µ m and smaller than 1.5 µ m. The number density of the small particles is 1 to 2000 pieces/ µ m 2 and the number density of the large particles is 0.05 to 2 pieces/µm 2 .</p> |
