| 摘要 |
PURPOSE:To make it possible to obtain a good connection state by preventing the diffusion of solder at the time of bonding, by providing a recessed part or a protruded part to a common electrode in order to connect other wiring systems. CONSTITUTION:A protective layer 24 is provided so as not only to prevent the oxidation of a heating element and the abrasion of a head but also to hold the insulation between a common electrode 108 and an aluminum support 153. The range of the protective layer 124 is C deg. in an A-direction and larger than the angle D deg. at the intersecting point of a seal material 120 and a lead-out electrode 121. Further, the range of said protective layer 124 is E deg. in a B-direction and larger than the angle F deg. at the intersecting point of the aluminum support 153 and the common electrode 108. The common electrode 108 has a solid pattern on the almost entire surface thereof but forms recessed or protruded parts 250... in the vicinity of the bonding point thereof and said recessed or protruded parts 250... are present at the same interval as the interval G of driving integrated circuit 119 or at an interval integer-times the interval G. By this method, the diffusion of solder is prevented at the time bonding. Further, the cutting angle H of each recessed part is smaller than the angle E deg. of the protective layer and the diffusion of solder in a circumferential direction is prevented. |
