发明名称 LEAD FRAME AND SEMICONDUCTOR INTEGRATED CIRCUIT USING THE SAME
摘要 PURPOSE:To lengthen intruding paths of water content and to improve the humidity resistance by a method wherein the lengths of tab-suspension leads are made larger by forming a tab in a longitudinal form in the direction intersection orthogonally to the tab-suspension leads. CONSTITUTION:In a lead frame consisting of outer frames 2 and 3, a pair of tabsuspension leads 4 and 5, a tab 6, outer leads 9 and 10 and inner leads 11 and 12, the tab 6 is formed in a longitudinal form in the direction intersecting orthogonally to the leads 4 and 5, that is, in the relation if the length L>the W of the tab 6. Whereupon, as the distances form positions, where the leads 4 and 5 are cut on the side surfaces of a sealing material, to the tab 6, in other words to a semiconductor chip which is fixed on the tab 6 become larger, the paths of water content which is liable to intrude along the leads 4 and 5 become larger. As a result, the intrusion of water content is reduced.
申请公布号 JPS62262446(A) 申请公布日期 1987.11.14
申请号 JP19860104665 申请日期 1986.05.09
申请人 HITACHI LTD 发明人 ISHII SHIGERU;SHIMIZU KAZUO
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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