| 摘要 |
PURPOSE: An epoxy resin composition is provided to effectively restrain the movement of metal ions like copper, etc between devices, while maintaining excellent adhesion even in high temperature, thereby giving excellent reliability to semiconductor device sealed by an epoxy resin composition even in high temperature. CONSTITUTION: An epoxy resin composition comprises 5-60 parts by weight of an epoxy resin, 10-60 parts by weight of butadiene acrylonitrile, 2-20 parts by weight of a curing agent, 0.2-5 parts by weight of a curing accelerator, 1-20 parts by weight of a polymer-modified nano-porous ion trapper, 0.5-5 parts by weight of additives, and 10-50 parts by weight of organic solvent. The polymer with anion functional group is modified to one or more kinds selected from polymers like polyethyleneimine based, carboxyl containing polyethyleneimine based, carboxyl containing polyacrylic based, and polyaminesulfonic based polymers. The nano-porous ion trapper as a mesoporous material is porous silicate, porous aluminosilicate, or zeolite. |
