THE LIGHT EMITTING DEVICE PACKAGE AND THE METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A light emitting device package and a manufacturing method thereof are provided to minimize an air gap between a light emitting structure and a substrate, by coating a printed circuit board using an insulator and a conductor. CONSTITUTION: A light emitting structure(50) is formed in the lower part of a transparent substrate(110). The light emitting structure includes a first conductive semiconductor layer(120), an active layer(130) and a second conductive semiconductor layer(140). A device pad(160) is formed in the lower part of the light emitting structure. A metallic projection(180) is formed on the device pad. An insulating layer(185) covers the lower part of the light emitting structure. A substrate pad(186) is formed in the upper side of the metallic projection.