发明名称 |
System and method for monitoring copper barrier layer preclean process |
摘要 |
A monitor wafer for use in monitoring a preclean process and method of making same are described. One embodiment is a monitor wafer comprising a silicon base layer; a capping layer disposed on the silicon base layer; and a barrier layer disposed on the USG layer. The monitor wafer further comprises a copper (Cu) seed layer disposed on the barrier layer; and a thick Cu layer disposed on the Cu seed layer.
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申请公布号 |
US8367545(B2) |
申请公布日期 |
2013.02.05 |
申请号 |
US201113115563 |
申请日期 |
2011.05.25 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.;SUNG KUO-LIANG;WENG CHENG-HUI |
发明人 |
SUNG KUO-LIANG;WENG CHENG-HUI |
分类号 |
H01L21/44;H01L21/00;H01L21/38;H01L21/768 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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