发明名称 System and method for monitoring copper barrier layer preclean process
摘要 A monitor wafer for use in monitoring a preclean process and method of making same are described. One embodiment is a monitor wafer comprising a silicon base layer; a capping layer disposed on the silicon base layer; and a barrier layer disposed on the USG layer. The monitor wafer further comprises a copper (Cu) seed layer disposed on the barrier layer; and a thick Cu layer disposed on the Cu seed layer.
申请公布号 US8367545(B2) 申请公布日期 2013.02.05
申请号 US201113115563 申请日期 2011.05.25
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.;SUNG KUO-LIANG;WENG CHENG-HUI 发明人 SUNG KUO-LIANG;WENG CHENG-HUI
分类号 H01L21/44;H01L21/00;H01L21/38;H01L21/768 主分类号 H01L21/44
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