| 摘要 |
<p>PURPOSE: A chip laminating method, a chip assembly laminated by the same, and a chip manufacturing method for the same are provided to electrically connect a chip pad exposed on a side of a chip in a simple process such as thermo-compression bonding. CONSTITUTION: A chip laminating structure of a chip(100)-first insulating layer(310)-chip is formed. A second insulating layer(320) is laminated on a side of the chip laminating structure. A conductive connecting member(340) is compressed inside the second insulating layer. One or more bumps(330) is formed in the conductive connecting member. A side of a chip pad(110) is exposed in the chip laminating structure. The bump is contacted with the chip pad.</p> |
