| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a fine structure transfer device capable of preventing the damage of a resin film that occurs when demolding after pressing the resin film to a mother stamper. <P>SOLUTION: The fine structure transfer device includes the mother stamper 12 formed with a fine uneven pattern on a surface 12a; a fixing frame 14 fixing the periphery of the mother stamper 12 detachably; and a support body for supporting the resin film 18 to face the fixing frame 14 and the surface 12a, having the fine uneven pattern, of the mother stamper. A level difference of an abutting or adjoining part of the mother stamper and fixing frame between the surface, having the fine uneven pattern, of the mother stamper and the surface, facing the resin film, of the fixing frame, is less than the thickness of the resin film. <P>COPYRIGHT: (C)2013,JPO&INPIT |
