发明名称 SIDE POLISHING METHOD OF HARD BRITTLE MATERIAL SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a polishing method capable of economically and hygienically polishing the side of a hard brittle material substrate while preventing chipping or cracking. <P>SOLUTION: An elastic abrasive 20 having abrasive grains 22 dispersed or adhered onto an elastic base material 21 is sprayed toward the side of a substrate 10' together with compressed air. The spray of the elastic abrasive is performed to a predetermined processing area F around a processing point P in a spray direction D intersecting a width-directional line W at the processing point P and forming a predetermined inclination &theta; selected from the range of 2-60&deg; relative to a contact line T. The processing area F is moved in the circumferential direction of the workpiece 10 at a fixed rate, and the spray nozzle 30 and the workpiece are relatively moved so that the spray direction D is maintained at each processing point P' where processing area is moved. When the substrate 10' is processed in an overlapped state, the processing area F is moved at a fixed rate also in the width direction of the substrate 10'. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013022684(A) 申请公布日期 2013.02.04
申请号 JP20110160147 申请日期 2011.07.21
申请人 FUJI SEISAKUSHO:KK 发明人 MASE KEIJI;ISHIBASHI SHOZO
分类号 B24C1/00;B24C5/02;B24C5/04;G11B5/84 主分类号 B24C1/00
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