VIBRATING DEVICE AND ELECTRONIC APPARATUS

摘要

A vibrating device has a package having an accommodating space in the interior thereof and a gyro element and an IC chip accommodated in the accommodating space. The package has a plate-like bottom plate having an IC chip mounting area and a vibrating element mounting area. The IC chip mounting area includes an IC chip mounting surface on which the IC chip is mounted. The vibrating element mounting area is arranged in parallel with the IC chip mounting area and includes a vibrating element mounting surface on which the gyro element is mounted. The thickness of the IC chip mounting area is smaller than that of the vibrating element mounting area. The IC chip mounting surface is located closer to a bottom side than the vibrating element mounting surface.