| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad by which a yield of a product is improved by reducing occurrence of a scratch and defect on a surface of a material to be polished by suppressing a polishing waste from attaching on a surface of the polishing pad, and high flatness and an appropriate polishing speed can be achieved in view of a background of a conventional technology. <P>SOLUTION: The polishing pad is characterized by that a zeta potential of a polishing surface opposite to the material to be polished has a value as: -100 mV≤the zeta potential value<-55 mV. <P>COPYRIGHT: (C)2013,JPO&INPIT |
