| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the antenna characteristic. <P>SOLUTION: A wireless device according to an embodiment of the present disclosure includes a semiconductor package, a mount board, and a first layer. The semiconductor package includes one or more antennas. The mount board has the semiconductor package loaded thereon. The first layer is formed of a conductor on a second surface of the mount board facing a first surface thereof to which the semiconductor package is connected, or is formed of a conductor between the first surface and the second surface. When the antenna is disposed closer to an end of the first layer than to the center of the first layer, at least a part of the end is concave. <P>COPYRIGHT: (C)2013,JPO&INPIT |
