发明名称 LED ASSEMBLY
摘要 THE PRESENT INVENTION RELATES TO AN ASSEMBLY OF HIGH POWER LED HAVING A PLURALITY OF COMPONENTS; A SURFACE MOUNT POWER SUPPLY (2), THE MAIN HOUSING HEAT SINK STRUCTURE (6) COUPLED WITH A HEAT TRANSFER PLATE (3), A HIGH POWER LED EMITTER (1), AN OPTICAL LENS (5), THE FRONT COVER (7) WITH OUTER RIM AND INNER RIM (7A). A HIGH TEMPERATURE INNER MOUNTING RING SEAL AND AN OPTIONAL INNER MOUNTING RING SEAL (9) IS MOUNTED ONTO SAID INNER RIM (7A) AND WITHIN THE AREA OF SAID HEAT TRANSFER PLATE (3) AS A MEANS FOR HOLDING THE LENS AND PROVIDING CONSTANT FORCE TO THE HIGH INTENSITY LED. THE PRESENT INVENTION IS ASSEMBLED IN AN INTEGRATED PACKAGE FOR FURTHER INCORPORATION INTO A LIGHTING DEVICE.
申请公布号 MY147879(A) 申请公布日期 2013.01.31
申请号 MY2007PI00529 申请日期 2007.04.05
申请人 POWERMICRO TECHNOLOGY SDN. BHD. 发明人 WONG WENG GHEE;SEOW CHOO GHEE
分类号 F21S8/00 主分类号 F21S8/00
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