发明名称 3D SEMICONDUCTOR MEMORY DEVICE
摘要 A 3D semiconductor memory device including a plurality of memory cell strings, includes a substrate and a channel that extends from the substrate. Memory cells may be disposed in layers in which the diameter of the channel varies. A programming verification operation may be carried out in a sequence whereby memory cells more likely to fail in programming are verified before attempting to verify memory cells that are less likely to fail programming. In an exemplary embodiment, the verification operation is performed on a memory cell disposed in a layer associated with a larger-diameter channel before performing the verification on a memory cell disposed in a layer associated with a smaller-diameter channel. In an exemplary embodiment, if a verification process detects a programming failure, the verification of subsequent memory cells is cancelled.
申请公布号 US2013028027(A1) 申请公布日期 2013.01.31
申请号 US201213526896 申请日期 2012.06.19
申请人 KIM JUNG-SOO;NAM SANG-WAN 发明人 KIM JUNG-SOO;NAM SANG-WAN
分类号 G11C16/06 主分类号 G11C16/06
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