| 摘要 |
PURPOSE: A molding method of an LED power supply using binary liquid-type silicon is provided to discharge heat generated by electric or electronic components outside by mixing silica powder with liquid silicon filled into a power supply for an LED. CONSTITUTION: A molding method of an LED power supply using binary liquid-type silicon is as follows. The humidity of an LED power supply is removed through a drying furnace(S100). An LED power supply device coated with silicon coating agent is dried(S120). 15 to 20wt.% of liquid silicon, 15 to 20wt.% of hardening agent, and 60 to 70wt.% of silica powder are stirred in 20 to 25°C temperature during 10 to 15 minutes(S130). Liquid silicon mixture fills the PCB(printed circuit board)(S140) of the LED power supply and an upper case. The liquid silicon mixture coats the inner space of a defoamation LED power supply(S160). The LED power supply is dried in 50 to 60°C temperature during one to two hours(S170). A lower cover plate is assembled on the dried LED power supply(S180). [Reference numerals] (S100) Step of removing humidity through a drying furnace; (S110) Step of applying a silicon coating material; (S120) Step of drying a coated power supply; (S130) Step of stirring a liquid silicon mixture; (S140) Step of primary charging; (S150) Step of defoaming; (S160) Step of secondary charging; (S170) Step of drying the secondly charged power supply; (S180) Step of assembling a lower cover plate |
