| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an ultrasonic cleaning apparatus and an ultrasonic cleaning method capable of suppressing occurrence of damage on a substrate to be cleaned, and capable of cleaning a high precision substrate used in the electronics industry with high cleanliness. <P>SOLUTION: While holding an object to be cleaned so as to be located under the level of cleaning liquid in the vicinity thereof on the outside of a region (ultrasonic wave irradiation region) extending from the vibration surface of an ultrasonic vibrator in a perpendicular direction to the liquid level, a surface-tension wave is excited on the surface of the cleaning liquid by ultrasonic waves. Occurrence of damage on the substrate to be cleaned is suppressed by exfoliating particulate contamination of the object to be cleaned by means of the sound pressure of the surface-tension wave, without irradiating the object to be cleaned directly with the ultrasonic waves. <P>COPYRIGHT: (C)2013,JPO&INPIT |
