发明名称 |
Semiconductor Devices, Packaging Methods and Structures |
摘要 |
Semiconductor devices, packaging methods and structures are disclosed. In one embodiment, a semiconductor device includes an integrated circuit die with a surface having a peripheral region and a central region. A plurality of bumps is disposed on the surface of the integrated circuit die in the peripheral region. A spacer is disposed on the surface of the integrated circuit die in the central region.
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申请公布号 |
US2013026623(A1) |
申请公布日期 |
2013.01.31 |
申请号 |
US201113194606 |
申请日期 |
2011.07.29 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.;CHEN YU-REN;TSENG MING HUNG;LAI YI-JEN |
发明人 |
CHEN YU-REN;TSENG MING HUNG;LAI YI-JEN |
分类号 |
H01L23/485;H01L21/56 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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