| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a composite silver wire with good mass production usability and low manufacturing cost which can avoid a problem lying in a bonding wire used to connect e.g. external connection terminals and electrodes on a semiconductor device, caused by elongation of a coated copper wire which may expose and oxidize copper of the core material. <P>SOLUTION: The composite silver wire contains silver as the main constituent, gold of 4 mass% or more and 8 mass% or less, and palladium of 2-4 mass%. <P>COPYRIGHT: (C)2013,JPO&INPIT |
