METHOD FOR MANUFACTURING CIRCUIT BOARD USING ELECTRICALLY CONDUCTIVE PARTICLES AND CIRCUIT BOARD MANUFACTURED BY THE METHOD

摘要

An exemplary method for manufacturing a circuit board includes, firstly, obtaining an insulating substrate, liquid heat-curable adhesive and electrically conductive particles. The electrically conductive particles are added into the liquid heat-curable adhesive. The electrically conductive particles in the heat-curable adhesive are activated by electrical discharge. Secondly, the liquid heat-curable adhesive having activated electrically conductive particles are spread on the insulating substrate to form a heat-curable adhesive layer on the insulating substrate. Thirdly, the heat-curable adhesive layer are exposed to the mid-infrared light by using a photo-mask, the photo-mask has a pattern corresponding to a desired circuit pattern of the circuit board. The electrically conductive particles relocated themselves one by one to form the circuit pattern under irradiation by the mid-infrared light. Finally, the heat-curable adhesive layer are hardening.