发明名称 |
MULTICHIP PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A method of manufacturing a multichip package structure includes: providing a substrate body; placing a plurality of light-emitting chips on the substrate body, where the light-emitting chips are electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, where the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, where the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body. |
申请公布号 |
US2013026507(A1) |
申请公布日期 |
2013.01.31 |
申请号 |
US201213633877 |
申请日期 |
2012.10.03 |
申请人 |
PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO., LTD.;PARAGON SEMICONDUCTOR LIGHTING TECHN |
发明人 |
CHUNG CHIA-TIN;WU FANG-KUEI |
分类号 |
H01L33/60;H01L33/52 |
主分类号 |
H01L33/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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