发明名称 PRINTED WIRING BOARD AND MANUFACTURING METHOD OF THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a printed wiring board having high connection reliability. <P>SOLUTION: A printed wiring board 100 includes a resin layer 106 and a fiber base material 108 positioned in the resin layer 106. An opening 116, having a region where an opening diameter becomes smaller from a first surface to a second surface and penetrating through the resin layer 106, is formed in the resin layer 106. The printed wiring board 100 has a conductor 124 burying the opening 116 and an inner circuit 104 electrically connecting with the conductor 124. The inner circuit 104 contacts with the second surface of the resin layer 106 and covers an opening surface of the opening 116 on the second surface side from the second surface side. The inner circuit (104) is formed as a separate body from the conductor 124. The fiber base material 108 has a protruding part 109 protruding from a side wall of the opening part 116, and the protruding part 109 is positioned in the conductor 124. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013021306(A) 申请公布日期 2013.01.31
申请号 JP20120133421 申请日期 2012.06.13
申请人 SUMITOMO BAKELITE CO LTD 发明人 KIMURA MICHIO;MITSUI YASUAKI;DAITO NORIYUKI;ENDO TADASUKE
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址