Insulated gate semiconductor device with optimized breakdown voltage and manufacturing method thereof

摘要

An insulated gate semiconductor device (30; 60; 90; 100; 150), comprising: a semiconductor body (32, 34, 36; 102, 104, 106) having a front side (32a; 36a; 106a) and a back side (32b; 102b) opposite to one another; a drift region (36; 106'), which extends in the semiconductor body and has a first type of conductivity and a first doping value; a body region (38; 108; 156) having a second type of conductivity, which extends in the drift region facing the front side of the semiconductor body; a source region (40; 113), which extends in the body region and has the first type of conductivity; and a buried region (44; 114) having the second type of conductivity, which extends in the drift region at a distance from the body region and at least partially aligned to the body region in a direction (Z) orthogonal to the front side and to the back side.