发明名称 ATOMIC LAYER ETCHING METHOD OF GRAPHENE
摘要 <p>PURPOSE: An atomic layer etching method is provided to control graphene etching with an atom as a unit, to selectively control the etching depth of graphene, to be processed uncomplicatedly, and to be commercialized. CONSTITUTION: An atomic layer etching method includes the following steps: absorbing a reactive radical on the surface of graphene; irradiating an energy source in graphene absorbed in the reactive radical; the two steps are repeated over two times; the graphene includes the thin film of overlapped multi-layer graphene; a singular layer of the thin film of graphene is etched by performing the atomic layer etching method one time; the reactive radical is generated with plasma.</p>
申请公布号 KR20130011922(A) 申请公布日期 2013.01.30
申请号 KR20120074309 申请日期 2012.07.09
申请人 RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY 发明人 YEOM, GEUN YOUNG;LIM, WOONG SUN;KIM, YI YEON;MIN, KYUNG SEOK
分类号 C01B31/02;B01J19/08;B01J19/12 主分类号 C01B31/02
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