| 摘要 |
PURPOSE:To provide a package with which each electrode of a semiconductor integrated circuit element, to be housed in the package, is electrically connected to the prescribed external electric circuit accurately. CONSTITUTION:The package is composed of an insulating substrate consisting of electric insulating material and having a placing part, where a semiconductor element 3 is placed, on the upper surface and also having an insulating substrate with a number of recessed parts 1b on the lower surface, a plurality of metallized wiring layer which are led out from the circumference of the placing part to the bottom face of the recessed parts 1b, a plurality of connection pads 5a formed on the bottom part of the recessed part 1b of the insulating substrate, where the metallized wiring layer is electrically connected, and a terminal which is soldered to the connection part 5a and having a spherical protruding part 7a on the lower surface of the insulating substrate. When the diameter of the spherical protruding part 1a of the terminal is set at D1, the diameter of the open bore of the recessed part 1b is set at D2 and the depth of the recessed part 1b is set at (d), the conditions of D2<D1, 0.3(mm)<=D2<=1.0(mm), d>=0.05(mm), 0.08<=d/D2<=0.85 are satisfied. |
