| 摘要 |
PROBLEM TO BE SOLVED: To provide an anisotropic conductive film exerting high adhesiveness to both a two-layer polyimide printed wiring board and a glass substrate, and thereby to provide a connection structure high in connection reliability. SOLUTION: This connection structure includes a first wiring board 1 with a conductor pattern 3 formed on a polyimide film 2 and a second wiring board 4 with a conductor pattern 6 formed on a glass substrate 5, wherein the first wiring board 1 and the second wiring board 4 are electrically connected through this thermosetting anisotropic conductive film 7. The anisotropic conductive film 7 is made of a laminated body having a first layer 7A in contact with the polyimide film 2 and a second layer 7B in contact with the glass substrate 5. The first layer 7A contains an epoxy resin constituent, a thermosetting agent, a phenoxy resin and nitrile rubber; and the second layer 7B contains an epoxy resin constituent, a thermosetting agent, phenoxy resin, and conductive particles without containing nitrile rubber. COPYRIGHT: (C)2010,JPO&INPIT |
