发明名称 Assembly to provide thermal cooling
摘要 In one aspect, an assembly to provide thermal cooling includes a first member having a first channel configured to receive a cooling fluid, a second member having a second channel configured to receive the cooling fluid and a first plurality of hollow and flexible conduits connecting the first and second members. Each of the first plurality of hollow and flexible conduits is configured to provide a path for the cooling fluid to flow between the first and second channels.
申请公布号 US8363413(B2) 申请公布日期 2013.01.29
申请号 US20100880350 申请日期 2010.09.13
申请人 RAYTHEON COMPANY;PAQUETTE JEFFREY;CHEYNE SCOTT R.;ELLSWORTH JOSEPH R. 发明人 PAQUETTE JEFFREY;CHEYNE SCOTT R.;ELLSWORTH JOSEPH R.
分类号 H05K7/20 主分类号 H05K7/20
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