发明名称 |
Assembly to provide thermal cooling |
摘要 |
In one aspect, an assembly to provide thermal cooling includes a first member having a first channel configured to receive a cooling fluid, a second member having a second channel configured to receive the cooling fluid and a first plurality of hollow and flexible conduits connecting the first and second members. Each of the first plurality of hollow and flexible conduits is configured to provide a path for the cooling fluid to flow between the first and second channels.
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申请公布号 |
US8363413(B2) |
申请公布日期 |
2013.01.29 |
申请号 |
US20100880350 |
申请日期 |
2010.09.13 |
申请人 |
RAYTHEON COMPANY;PAQUETTE JEFFREY;CHEYNE SCOTT R.;ELLSWORTH JOSEPH R. |
发明人 |
PAQUETTE JEFFREY;CHEYNE SCOTT R.;ELLSWORTH JOSEPH R. |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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