发明名称 RESIN COMPOSITION SHEET, RESIN COMPOSITION SHEET WITH METAL FOIL, METAL BASE WIRING BOARD MATERIAL, METAL BASE WIRING BOARD AND ELECTRONIC MEMBER
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin composition sheet that forms a resin cured product having excellent thermal conductivity and electric insulation and the resin composition sheet with a metal foil, and a metal base wiring board material, a metal base wiring board and an LED light source member that are formed using them. <P>SOLUTION: The resin composition sheet comprises a polyfunctional epoxy resin containing two or more six-membered ring structures in the molecule, a phenol resin, an insulating inorganic filler and a condensed reaction product of a silicon compound containing a hydrolyzable group. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013014670(A) 申请公布日期 2013.01.24
申请号 JP20110147696 申请日期 2011.07.01
申请人 HITACHI CHEMICAL CO LTD 发明人 NISHIMURA MASATO
分类号 C08L63/00;B32B15/08;B32B27/38;B32B27/42;C08G59/62;C08K3/00;C08K5/5415;H05K1/03;H05K1/05;H05K7/20 主分类号 C08L63/00
代理机构 代理人
主权项
地址