| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polyimide film excellent in dimensional stability and suitable for a substrate for fine pitch circuit, particularly COF (Chip on film) in which wiring is carried out at naroow pitches in the width direction, and a copper-clad laminate using the same as a substrate material. <P>SOLUTION: The polyimide film has a thermal expansion coefficient αMD in the machine transport direction (MD) of the film of 3 to 10 ppm/°C, and a thermal expansion coefficient αTD in the transverse direction (TD) of 10 to 20 ppm/°C. With the polyimide film used as a substrate material, copper of 1 to 10 μm in thickness is formed thereon. <P>COPYRIGHT: (C)2013,JPO&INPIT |
