BONDING SYSTEM, SUBSTRATE PROCESSING SYSTEM, AND BONDING METHOD

摘要

This bonding system comprises a bonding station and a carry in/out station which carries a substrate to be processed, a supporting substrate or a bonded substrate that is obtained by bonding a substrate to be processed and a supporting substrate with each other into/out of the bonding station. The bonding station comprises: a coating device which applies an adhesive to the substrate to be processed or the supporting substrate; a heat treatment device that heats the substrate, to which the adhesive has been applied, to a predetermined temperature; a bonding device which turns over the supporting substrate that is to be bonded to the heated substrate to be processed or the substrate to be processed that is to be bonded to the heated supporting substrate and which presses the overturned substrate against the heated substrate with an adhesive being interposed therebetween, thereby bonding the substrates with each other; and a conveyance region for conveying these substrates to the coating device, the heat treatment device and the bonding device.