发明名称 VACUUM DEPOSITION APPARATUS AND METHOD FOR MANUFACTURING THIN FILM
摘要 <P>PROBLEM TO BE SOLVED: To measure the film thickness of thin films of a number of substrates during film deposition while maintaining a vacuum atmosphere. <P>SOLUTION: When a plurality of sample plates 16 are arranged in a vacuum container 12 and a thin film is grown on the film deposition surface of a substrate, a thin film is also grown on the detection face 61 of the sample plate 16, and the film thickness of the thin film on the surface of the sample plate 16 is measured by irradiating the surface of the sample plate 16 with measurement light. Since a metal electrode is not required for the sample plate 16 and the sample plate 16 can be heated to a high temperature, the thin film deposited on the detection face 61 is removed by heating, and the sample plate 16 is reused. Consequently, it is possible to measure the film thickness of the thin films of a number of substrates, while maintaining the vacuum atmosphere. The waiting time for removing the thin film does not occur by preparing a plurality of sample plates 16 in the vacuum atmosphere and measuring the film thickness of the thin film deposited on one sample plate 16 while another sample plate 16 having a thin film deposited thereon is heated. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013014798(A) 申请公布日期 2013.01.24
申请号 JP20110147504 申请日期 2011.07.01
申请人 ULVAC JAPAN LTD 发明人 YO ITSUSHIN
分类号 C23C14/54;C23C14/24;C23C14/56;G01B11/06 主分类号 C23C14/54
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