| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electroless nickel plating solution which can minimize the contamination of an electroless plating film with environmentally hazardous substances other than nickel, yet has excellent stability, and can provide a plating film having excellent mechanical properties. <P>SOLUTION: The electroless nickel plating film contains 0.5-4 wt.% phosphorus, 0.01-2 wt.% boron, and 0.1-5 wt.% tin. The electroless nickel plating film can be obtained by using the electroless nickel plating solution containing 0.04-0.2 mol/L of nickel ions, 0.09-0.5 mol/L of hypophosphite ions, 1-80 mmol/L of tetrahydro borate ions, and 50-1,000 μmol/L of divalent tin ions. <P>COPYRIGHT: (C)2013,JPO&INPIT |
